Multi-Port Polishing Fixture Assembly and Method of Surface Conditioning a Pick and Place Bond Head

ABSTRACT

Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.

RELATED APPLICATIONS

This application claims the benefit of priority of U.S. ProvisionalApplication No. 62/959,364 filed Jan. 10, 2020, which is incorporatedherein by reference.

BACKGROUND Field

Embodiments described herein relate to transfer tools for surface mounttechnology.

Background Information

State of the art surface mount technology (SMT) utilizes a vacuum orelectrostatic bonding tool to directly pick electrical components (suchas silicon and gallium nitride) from wafers or die and place them ontarget substrates (such as glass, silicon, printed circuit board,flexible printed circuit board) to create electrical circuits oftenreferred to as surface mount devices (SMD).

Electrical joints can be created on the bottom surface of a componentduring placement by connecting bond pads with an electrically conductiveadhesive bonding material using bonding techniques such as eutecticbonding, soldering, anisotropic conductive paste bonding, etc. Suchadhesive bonding techniques can rely on temperature, pressure and thereflow properties of the adhesive bonding material to form a reliablemechanical connection to the substrate.

Electrical connections can also be formed on the top surface ofcomponent after placement by subsequent processes. One example of suchprocessing is the deposition of a planarization material followed bypatterned metal interconnects. Devices that rely on metal connectionsformed on a component top surface may also utilize an adhesive bondingmaterial to fix the component to the substrate. The adhesive bondingmaterial may or may not be electrically conductive depending uponconnections to be made. Non-conductive adhesive bonding materialsinclude glue, tape, polymer, other adhesive layers, etc. Such thinadhesive layers can be slot die coated, spin coated, dispensed orsprayed onto the substrate.

SUMMARY

Embodiments describe multi-port polishing fixture assemblies, pick andplace bond heads, split holders and methods of conditioning pick andpace bond heads with the multi-port polishing fixture assemblies. In anembodiment, a multi-port polishing fixture assembly includes a fixturebase with a perimeter surface, a plurality of kinematic clampsfastenable along the perimeter surface, and a plurality of split holdersfastenable to the perimeter surface with the plurality of kinematicplurality of kinematic clamps. Such a multi-port polishing fixture maybe utilized to condition a pick and place bond head by loading themulti-port polishing fixture assembly with a plurality of pick and placebond heads secured within a corresponding plurality of split holders,and polishing the plurality of pick and place bond heads andcorresponding plurality of split holders. In such a configuration, thesplit holders may act as a sacrificial material flattening the polishingpad of the polishing apparatus before it contacts the pick and placebond head in order to mitigate edge-fast polishing. In a particularembodiment, a pick and place bond head includes an elongate body, apedestal at a distal end of the elongate body, and a plurality of mesastructures extending from the pedestal. Each mesa structure may includea distal bond surface with one or more vacuum holes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view illustration of a polishing apparatus inaccordance with an embodiment.

FIG. 2 is an isometric view illustration showing a distal bond surfaceof a pick and place bond head in accordance with an embodiment.

FIG. 3 is an isometric view illustration of a pick and place bond headarranged within a split holder in accordance with an embodiment.

FIG. 4 is a schematic top view illustration of a multi-port polishingfixture assembly and close-up top view illustration of a kinematic clampfastened to a perimeter surface of a fixture base in accordance with anembodiment.

FIG. 5A is an isometric view illustration of a two-part split holder inaccordance with an embodiment.

FIG. 5B is a schematic top view illustration of a two-part split holderfastened to a perimeter surface of a fixture base in accordance with anembodiment.

FIG. 6A is a side view illustration of a pick and place bond head with aplurality of mesa structures extending from a pedestal in accordancewith an embodiment.

FIG. 6B is an isometric view illustration of the pick and place bondhead of FIG. 6A showing distal bond surfaces and vacuum holes inaccordance with an embodiment.

FIG. 6C is a schematic cross-sectional side view illustration of thepick and place bond head of FIG. 6A showing vacuum holes connected toindividual vacuum channels within the pick and place bond head shank inaccordance with an embodiment.

FIG. 6D is a schematic cross-sectional side view illustration of thepick and place bond head of FIG. 6A showing vacuum holes connected to asame vacuum channel within the pick and place bond head shank inaccordance with an embodiment.

FIG. 7A is an image of a non-conditioned distal bond surface of a pickand place bond head in accordance with an embodiment.

FIG. 7B is a plot of profilometer in the x-direction across the distalbond surface of the pick and place bond head of FIG. 7A.

FIG. 7C is a plot of profilometer in the y-direction across the distalbond surface of the pick and place bond head of FIG. 7A.

FIG. 8A is an image of conditioned distal bond surface of a pick andplace bond head in accordance with an embodiment.

FIG. 8B is a plot of profilometer in the x-direction across the distalbond surface of the pick and place bond head of FIG. 8A.

FIG. 8C is a plot of profilometer in the y-direction across the distalbond surface of the pick and place bond head of FIG. 8A.

FIGS. 9A-9G are schematic cross-sectional side view illustrations of asequence of transferring and integrating components in accordance withan embodiment.

DETAILED DESCRIPTION

Embodiments describe multi-port polishing fixture assemblies, pick andplace bond heads, split holders, and methods of conditioning pick andpace bond heads with the multi-port polishing fixture assemblies for usein surface mount technology (SMT).

It has been observed that conventional bonding tools used to pick andplace components have typically greater than 5 μm surface roughness dueto machining processes of vacuum holes (laser, drilling) and surfacefinishing (electric discharge machining, drilling). Flatness of the pickand place tool is also not controlled and can lead to significanttopography of the placed component making it difficult or impossible toform top metal connections after placement. Furthermore, such a surfaceroughness can also damage (e.g. scratch) top contact pads (e.g. metal)when present on components being transferred, leading to possiblefailure to form electrical connection after placement.

Furthermore, it has been observed that rougher surfaces can directlytranslate to adhesive wetting bubbles underneath the transferredcomponent. Adhesive wetting is especially sensitive for ultra-thin (e.g.less than 10 μm) chips. Bubbles or non-uniform wetting eventually canaffect component total thickness variation (TTV) during final adhesivecuring process beyond 2 μm TTV since roughness of the bonding tools cantranslate to TTV of the transferred components. This variation canaffect planarization and contact making process and demands largermargin and effectively larger chip or component area ultimatelyimpacting cost of the materials. Further, this can impact via size andintegrity of electrical connection to top contacts of a transferredcomponent.

In one aspect, embodiments describe a pick and place bond head polishingprocess that can reduce surface roughness and other machining relatedmanufacturing process non-uniformities. The embodiments can also enablere-using contaminated or damaged pick and place bond heads during themanufacturing process, which can reduce cost for SMD.

In an embodiment a multi-port polishing fixture assembly includes afixture base with a perimeter surface, a plurality of a plurality ofkinematic clamps fastenable along the perimeter surface, and a pluralityof split holders fastenable to the perimeter surface with the pluralityof kinematic plurality of kinematic clamps. In operation, a plurality ofpick and place bond heads can be secured within a correspondingplurality of split holders and then polished with a polishing apparatusincluding the multi-port polishing fixture assembly positioned over apolishing pad. In accordance with embodiments the split holders, used toclamp the pick and place bond heads, act as a sacrificial material, andprovide pressure uniformity to the pick and place bond heads and avoidedge-fast polishing that is prevalent in traditional film or chemicalmechanical polishing (CMP) based approaches. In accordance withembodiments, the polishing processes and equipment can be utilized toachieve distal bond surfaces of the pick and place bond headscharacterized by an average surface roughness (Ra) of 50 nm-0.5 μm and aflatness of less than 300 nm. This can facilitate the transfer ofcomponents with lower resulting TTV on the receiving substrate, andenable reliable top side and/or bottom side electrical connections to bemade with the components. Where a pick and place bond head includesmultiple mesa structures with multiple distal bond surfaces 202, theflatness (e.g. of less than 300 nm) may be extended across a totalsurface area including each distal bond surface 202 for every mesastructure 250.

In various embodiments, description is made with reference to figures.However, certain embodiments may be practiced without one or more ofthese specific details, or in combination with other known methods andconfigurations. In the following description, numerous specific detailsare set forth, such as specific configurations, dimensions andprocesses, etc., in order to provide a thorough understanding of theembodiments. In other instances, well-known semiconductor processes andmanufacturing techniques have not been described in particular detail inorder to not unnecessarily obscure the embodiments. Reference throughoutthis specification to “one embodiment” means that a particular feature,structure, configuration, or characteristic described in connection withthe embodiment is included in at least one embodiment. Thus, theappearances of the phrase “in one embodiment” in various placesthroughout this specification are not necessarily referring to the sameembodiment. Furthermore, the particular features, structures,configurations, or characteristics may be combined in any suitablemanner in one or more embodiments.

The terms “over”, “to”, “between”, and “on” as used herein may refer toa relative position of one layer with respect to other layers. One layer“over” or “on” another layer or bonded “to” or in “contact” with anotherlayer may be directly in contact with the other layer or may have one ormore intervening layers. One layer “between” layers may be directly incontact with the layers or may have one or more intervening layers.

Referring now to FIG. 1 an isometric view illustration is provided of apolishing apparatus 100 in accordance with an embodiment. Such apolishing apparatus 100 may include a base 102 which supports arotatable platen 110 and pivot arm 120 which is positionable over theplaten 110. In a particular configuration, one or more joints 122 may beincluded to adjust position of the pivot arm 120, for example radiallyswinging motion with a z-direction vector to assemble system components.Joint 122 may additionally provide fine x-y-z positioning of the pivotarm 120.

A connector 124 may be fastened along a length of the pivot arm 120. Amulti-port polishing fixture assembly 150 may additionally be connectedto a distal end portion of the pivot arm 120. In this manner the pivotarm 120 can be adjusted to provide pressure to the multi-port polishingfixture assembly 150 as it is contacted with a polishing pad 112 on therotatable platen 110.

In an embodiment, a multi-port polishing fixture assembly 150 includes afixture base 130 with a perimeter surface 131, a plurality of aplurality of kinematic clamps 140 fastenable along the perimeter surface131, and a plurality of split holders 160 fastenable to the perimetersurface 131 with the plurality of kinematic plurality of kinematicclamps 140. In use, pick and place bond heads 200 are clamped inside thecorresponding split holders 160, and fastened to the perimeter surface131 using the plurality of kinematic clamps 140. Thus, the kinematicclamps 140 can be used to secure the bond heads 200 inside thecorresponding split holders 160, as well as to secure the bond heads andsplit holders 160 to the fixture base 130.

The multi-port polishing fixture assemblies 150 in accordance withembodiments may be utilized to polish a variety of tools, in particular,pick and place bond heads used for high-throughput pick and place ofcomponents from a high density source substrate to a lower densitytarget substrate. Exemplary fields of application can include fan-outwafer level packaging, fan-out panel level packaging, etc. Embodimentsdescribed herein may be used to condition tools used for the transfer ofany ultra-thin components where bond head surface planarity can affectTTV of the transferred component.

FIG. 2 is an isometric view illustration showing a distal bond surface202 of a pick and place bond head 200 in accordance with an embodiment.As shown, the pick and place bond head 200 may include an elongate body230 (or shank), a distal bond surface 202, and one or more vacuum holes210 in the distal bond surface 202. As illustrated, the elongate body230 may optionally include a distal platform (or pedestal 220) at thedistal end of the elongate body. The distal bond surface 202 may be thedistal surface of the pedestal 220. The elongate body 230 may have alength that is greater than its width. The elongate body 230 may be usedfor mounting within a mass transfer tool, as well as within themulti-port polishing fixture assembly 150. The elongate body 230 canassume different geometric shapes, such as cylindrical, cuboid(rectangular), polygonal, etc. In an embodiment, the distal bond surface202 has a maximum lateral dimension of less than 500 μm. In anembodiment, the vacuum hole(s) 210 each have a maximum width of lessthan 75 μm. Such dimensions may be exemplary of micro-sized componentsto be transferred, which can also be susceptible to TTV after placement.

FIG. 3 is an isometric view illustration of a pick and place bond head200 arranged within a split holder 160 in accordance with an embodiment.In the particular embodiment illustrated the split holder 160 includes atubular member 161 and one or more slits 164. The slit(s) 164 may bealong a longitudinal length of the tubular member 161. In an embodiment,the slit(s) extend from a distal surface 162 of the tubular member 161and partially down a longitudinal length of the tubular member. Inaccordance with embodiments, the split holder 160 and pick and placebond head 200 are sized such that the pick and place bond head 200 canbe secured inside the split holder 160 (for example, with the kinematicclamps 140) with the distal surface 162 of the tubular member 161parallel to the distal bond surface 202 of the pick and place bond head200. During polishing, such an arrangement can provide conditions forpressure uniformity across the distal bond surface 202 with thepolishing pad 112. This can mitigate edge fast polishing, and relateddishing that occurs along edges of a tool prevalent in traditionalpolishing techniques.

FIG. 4 is a schematic top view illustration of a multi-port polishingfixture assembly 150 and close-up top view illustration of a kinematicclamp 140 fastened to a perimeter surface 131 of a fixture base 130 inaccordance with an embodiment. In the embodiment illustrated, thefixture base 130 is a plate (e.g. metal). A center portion may includecontact holes 137, for example to fasten to the connector 124 of thepolishing apparatus 100. The perimeter surface 131 of the fixture base130 may optionally include a plurality of cavities 132 and support tabs134 between adjacent cavities 132. Such an arrangement may provideadditional support for securing the kinematic clamps 140.

In an embodiment, the perimeter surface 131 includes a plurality ofkinematic fixturing patterns 138, which will receive a correspondingplurality of split holders 160. In the illustrated embodiment, thekinematic fixturing patterns 138 are V-grooves, though otherconfigurations may be used, such as semi-circle, rectangle, slot, etc.In an embodiment, the fixture base 130 additionally includes a pluralityof threaded holes 136 along the perimeter surface 131 in order toreceive a screw 144 of a corresponding kinematic clamp 140. Referringnow to the close-up illustration in FIG. 4, in an embodiment a kinematicclamp 140 includes a pressure bar 142 and the screw 144 is threadedthrough a threaded hole 146 in the pressure bar and into the threadedhole 136 along the perimeter surface 131 of the fixture base 130. Inthis manner, tightening of the screw 144 will fasten the kinematic clamp140 to the perimeter surface, upon which the pressure bar 142 willsecure the split holder within the fixturing pattern 138 and between thepressure bar 142 and perimeter surface 131. The split holder 160 in turnsecures the bond head 200 within the split holder 160.

Also illustrated in FIG. 4 is a pair of dummy rods 400 fastened to theperimeter surface 131 of the fixture base 130 with a kinematic clamp140. The dummy rods 400 may have similar dimensions as the split holders160, though this is not required as long as they may be similarlyfastened. As described in further detail below the dummy rods 400 may beused to set a polishing height for the tools (e.g. the pick and placebond heads). A plurality of dummy rods 400 may be fastened to thefixture base 130 for setting the polishing height.

It is to be appreciated that the particular embodiment illustrated inFIG. 4 is intended to be a particularly graceful implementation andembodiments are not so limited. For example, the pressure bars 142 mayinclude multiple threaded holes 146 to receive multiple screws 144, orthe threaded holes 146 may not be threaded. Alternatively, fasteningmechanisms such as springs, clips, etc. may be utilized. As anotherexample, each threaded hole 136 in the fixture base 130 is between twofixturing patterns 138. However, other arrangements and ratios areenvisioned. Furthermore, it is to be appreciated that each cavity 132may receive a corresponding kinematic clamp 140, or a plurality ofkinematic clamps 140.

Up until this point embodiments have been described in which the splitholder 160 is a physically separate component from the kinematic clamp140 and fixture base 130. Thus, a tubular split holder 160 may be adiscrete component. The split holders 160 in accordance with embodimentscan also be designed as being a part of the kinematic clamp 140, fixturebase 130, or both.

Referring now to FIGS. 5A-5B, FIG. 5A is an isometric view illustrationof a two-part split holder 160 in accordance with an embodiment. FIG. 5Bis a schematic top view illustration of a two-part split holder 160fastened to a perimeter surface 131 of a fixture base 130 in accordancewith an embodiment. In the particular embodiment illustrated, a two-partsplit holder 160 includes a first split holder side 160A and secondsplit holder side 160B, which may be identical. Each split holder side160A, 160B may include a half-tubular body 163 coupled with a mountingbracket 502. As shown, an interior side of the mounting bracket 502adjacent the inner surface of the half-tubular body 163 can include arecess 504 and through hole 506. In an embodiment, through holes 506 arelongitudinal slots, which will accommodate adjusting a height of thecorresponding split holder side in the assembly. For example, this mayaccommodate eventual polishing down the length of the half-tubular body163. Screws 514 can be threaded through the through holes 506 and intothrough holes 139 along the perimeter surface 131 of the fixture base130 to secure one of the split holder sides. Similarly screws 514 can bethreaded through the through holes 506 and into the through holes 149 inthe pressure bar 142 of the kinematic clamp 140 to secure the othersplit holder side. In this manner, each split holder side 160A, 160B canbe fixed to a corresponding pressure bar 142 and fixture base 130. Uponthreading the screw 144 through the threaded hole 146 in the pressurebar 142 and into the threaded hole 136 along the perimeter surface 131of the fixture base 130, the kinematic clamp 140 will be fastened to theperimeter surface, upon which the two-part split holder 160 secures thebond head 200 within the two half-tubular bodies 163. Similar to theprevious tubular member 161, the half-tubular bodies 163 have alongitudinal length and distal surface 162 that may be arranged parallelto a distal bond surface 202 of a bond head 200.

Up until this point the pick and place bond head 200 has been describedas including a single distal bond surface 202, however, embodimentsenvision bond heads 200 with multiple distal bond surfaces 202, whichcan be used to pick up a same component together, or each distal bondsurface 202 to pick up a separate component. Referring now to FIGS.6A-6B, FIG. 6A is a side view illustration of a pick and place bond head200 with a plurality of mesa structures 250 extending from a pedestal220 in accordance with an embodiment. FIG. 6B is an isometric viewillustration of the pick and place bond head of FIG. 6A showing distalbond surfaces 202 and vacuum holes 210 in accordance with an embodiment.

In the illustrated embodiment, the pick and place bond head 200 includesan elongate body 230, a pedestal 220 at a distal end of the elongatebody 230, and a plurality of mesa structures 250 extending from thepedestal. The pedestal 220 may be an integral distal portion of theelongate body, or alternatively a discrete shape or part of the pick andplace bond head 200. Each mesa structure 250 may include a distal bondsurface 202 including one or more vacuum holes 210. In an embodiment,each distal bond surface 202 has a maximum lateral dimension of lessthan 500 μm. In an embodiment, each vacuum hole 210 has a maximum widthof less than 75 μm.

The vacuum holes in accordance with embodiments are then connected toone or more vacuum channels within the pick and place bond head 200 forconnection to a vacuum source of the mass transfer tool to which thepick and place bond heads 200 will be attached. FIGS. 6C-6D illustratenon-limiting examples of different vacuum channels. In the exemplaryembodiment illustrated in FIG. 6C, the individual vacuum channels 270extend through the mesa structures 250, pedestal 220, and elongate body230. For example, the vacuum channels can extend through an axial lengthof the elongate body 230. The individual vacuum channels 270 canoptionally merge into shared vacuum channels (and thus be fluidlyconnected) within the pedestal 220 and/or elongate body 230. In theparticular embodiment illustrated in FIG. 6D, the individual channels270 are merged into a shared channel 235 within the pedestal 220 and/orthe elongate body 230. A variety of configurations are possible. Inaccordance with embodiments the arrangement of vacuum channels 270 andshared channel 235 can be included in the embodiment illustrated in FIG.2.

The pick and place bond heads 200 in accordance with embodiments may beconditioned with the polishing apparatus 100 before first use, or afteruse during a sustained period of operation with a mass transfer tool.For example, conditioning prior to initial use may remove defects orsurface roughness characteristic of manufacturing processnon-uniformities. Conditioning after sustained use can address damagedor contaminated distal bond surfaces. In both applications, theconditioned distal bond surfaces 202 can be characterized by an averagesurface roughness (Ra) of 50 nm-0.5 μm in an embodiment. In anembodiment, a conditioned distal bond surface 202 is characterized by aflatness of less than 300 nm. In an embodiment, a total surface areaincluding each distal bond surface 202 for every mesa structure 250 ischaracterized by a flatness of less than 300 nm. Thus, the flatness maybe translated across each mesa structure 250 in the pick and place tool.Such parameters may facilitate the ability to transfer flat componentswith proper adhesive wetting. Additionally, refurbishing of contaminatedor damaged pick and place bond heads 200 in a manufacturing process canreduce cost for surface mount devices (SMD).

In an embodiment, an exemplary conditioning process includes loading amulti-port polishing fixture assembly 150 with a plurality of tools(e.g. pick and place bond heads 200) secured within a correspondingplurality of split holders 160, and polishing the plurality of tools andcorresponding plurality of split holders, for example, to averagesurface roughness (Ra) of 50 nm-0.5 μm and flatness of less than 300 nm.

Loading the multi-port polishing fixture assembly 150 may includefastening the plurality of split holders 160 to a perimeter surface 131of a fixture base 130 with a plurality of kinematic clamps 140. In someembodiments, the split holders 160 (and pick and place bond heads 200)may be loosely fastened initially in order to set a polishing height,and only tightly fastened in place after setting the polishing height.Setting the polishing height may include, prior to polishing, loadingone or more dummy rods 400 into the multi-port polishing fixturesimilarly as the split holders 160, and clamped tight. Dummy rods 400may, for example, have similar dimensions as the split holders 160, asshown in FIG. 4. The dummy rods 400 are then pressed against thepolishing pad 112. The polishing height can then be set for theplurality of tools (pick and place bond heads 200) and split holders 160by applying pressure to the proximal ends of the pick and place bondheads 200 and split holders 160 so that they also are pressed againstthe polishing pad, followed by tightly fastening the plurality of tools(pick and place bond heads 200) and split holders 160 in place at thepolishing height. Thus, the length of the split holders 160, bond head200, and dummy rods 400 extending between the polishing pad 112 and themulti-port polishing fixture assembly 150 are equal. Once the polishingheight has been set, the polishing operation may be performed with thepick and place bond heads 200 and split holders 160 secured in place.

In accordance with embodiments, the pick and place bond heads 200 areloaded such that the split holders 160 and distal bond surfaces 202 areplanar to each other. The split holders 160 act as a sacrificialmaterial flattening the polishing pad 112 before it contacts the pickand place bond head 200. In accordance with embodiments, an exemplarypolishing pad 112 may be an alumina (Al₂O₃) lapping film. For example,this may be a 0.3-5.0 micron alumina lapping film with no adhesive. Thepolishing fluid may be deionized (DI) water. In such an embodiment, anabrasive slurry is not utilized.

In order to illustrate effectiveness of the polishing apparatus 100 andconditioning sequence in accordance with embodiments, an as receivedpick and place bond head 200 was inspected and surface contour weremeasured with a profilometer, followed by conditioning and againinspecting and measuring the surface contour after conditioning. In thisparticular example, conditioning was performed with a 5.0 micron aluminapolishing pad, 20 rotations per minute (RPM) platen speed, 0.5 pounds offorce applied to the multi-port polishing fixture assembly 150, with DIwater, for 60 second polishing time.

Images of the pick and place bond head distal surfaces 202 are providedin FIGS. 7A and 8A, respectively, for as-received and post conditioning.The visible contour shows bright (white) areas corresponding to nominalvalue, and darker regions corresponding to variable heights (+/−). FIGS.7B and 8B, respectively, are plots of profilometer data in thex-direction across the distal bond surface of FIGS. 7A and 8A foras-received and post conditioning. FIGS. 7C and 8C, respectively, areplots of profilometer data in the y-direction across the distal bondsurface of FIGS. 7A and 8A for as-received and post conditioning.Notably, in addition to reduced surface roughness, the profilometer dataadditionally illustrates a reduction in dishing around the distal bondsurface 202 edges, which can contribute to planarity improvement, andhence TTV of a transferred component.

Improved planarity across the distal bond surfaces 202 in accordancewith embodiments may facilitate the ability to provide a more uniformpressure to a component during pick and place, and in particular,placement onto a receiving substrate. In an embodiment, placement of acomponent onto a receiving substrate include heat and/or pressure, andpotentially reflow or deformation of an adhesive bonding material.Application of non-uniform pressure due to surface roughness orinsufficient flatness of the distal bond surfaces 202 can result innon-uniform wetting or bubbles underneath the transferred components andunacceptable TTV of the placed components. This can affect the abilityto make either or both top side or bottom side connections to the placedcomponents.

FIGS. 9A-9G are schematic cross-sectional side view illustrations of asequence of transferring and integrating components 910 in accordancewith an embodiment. The particular sequence is illustrated as makingboth top side and bottom side electrical connections, though embodimentsdo not require such. For example, only top side or bottom sideelectrical connections may be made. As shown in FIG. 9A a pick and placebond head 200 including one or more distal bond surfaces 202 ispositioned over an array of components 910 on a carrier substrate 902.The distal bond surfaces 202 are then contacted with a correspondingplurality of components 910, as shown in FIG. 9B. Application of vacuumpressure may then be utilized to pick up the plurality of components 910a shown in FIG. 9C.

The plurality of components can then be positioned over a receivingsubstrate 920. As shown in FIG. 9D, the receiving substrate may have oneor more bonding layers 922 (e.g. solder, paste, film, tape, glue, etc.)for receiving the corresponding components 910. Individual conductivebonding layers 922 may be placed to make electrical connection withindividual component contact pads. Alternatively, individual or a commonnon-conductive bonding layer 922 (e.g. adhesive film, tape, glue, etc.)can be applied for receiving the components 910.

As shown in FIG. 9E, the components 910 are brought into contact withthe bonding layers 922, which may include heat and pressure, anddeformation of the bonding layers 922. In accordance with embodiments,flatness of the distal bond surfaces 202 contributes toreflow/deformation of the bonding layer(s) 922, underside wetting of thecomponents 910 with the bonding layer(s) 922 and hence resultant TTV ofthe components 910 after placement onto the receiving substrate.Referring now to FIG. 9F, one or more filler layers 930 (e.g.planarization layers) can be formed around the components 910. In anembodiment, this is a single insulating material layer, though thiscould be multiple layers, and can include electrical routing. This maybe followed by the formation of one or more contact layers 940 (e.g.metal layer, etc.) over the filler layers 930 and components 910.Electrical contact with the components 910 may be aided by low TTV ofthe components 910.

In utilizing the various aspects of the embodiments, it would becomeapparent to one skilled in the art that combinations or variations ofthe above embodiments are possible for conditioning a bond head surface.Although the embodiments have been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the appended claims are not necessarily limited to the specificfeatures or acts described. The specific features and acts disclosed areinstead to be understood as embodiments of the claims useful forillustration.

What is claimed is:
 1. A multi-port polishing fixture assemblycomprising: a fixture base including a perimeter surface; a plurality ofkinematic clamps fastenable along the perimeter surface; and a pluralityof split holders fastenable to the perimeter surface with the pluralityof kinematic plurality of kinematic clamps.
 2. The multi-port polishingfixture assembly of claim 1, wherein each split holder comprises atubular member, and a slit in the tubular member extending from a distalend of the tubular member.
 3. The multi-port polishing fixture assemblyof claim 2, wherein the slit partially extends down a longitudinallength of the tubular member.
 4. The multi-port polishing fixtureassembly of claim 1, wherein each split holder comprises a pair ofhalf-tubular bodies.
 5. The multi-port polishing fixture assembly ofclaim 1, wherein the plurality of split holders are secured to thecorresponding plurality of kinematic clamps.
 6. The multi-port polishingfixture assembly of claim 1, wherein the plurality of split holders arephysically separate from the corresponding plurality of kinematicclamps.
 7. The multi-port polishing fixture assembly of claim 1, whereinthe perimeter surface includes a plurality of kinematic fixturingpatterns to receive the plurality of split holders.
 8. The multi-portpolishing fixture of claim 7, wherein each kinematic fixturing patternis a V-groove.
 9. The multi-port polishing fixture assembly of claim 1,wherein each kinematic clamp includes a pressure bar and screw threadedthrough the pressure bar.
 10. The multi-port polishing fixture assemblyof claim 9, wherein the fixture base includes a plurality of threadedholes along the perimeter surface, each hole to receive the screw of acorresponding kinematic clamp.
 11. A method of conditioning a pick andplace bond head comprising: loading a multi-port polishing fixtureassembly with a plurality of tools secured within a correspondingplurality of split holders; and polishing the plurality of tools andcorresponding plurality of split holders.
 12. The method of claim 11,further comprising: loading the multi-port polishing fixture assemblywith a plurality of dummy rods; pressing the plurality of dummy rodsagainst a polishing pad; setting a polishing height for the plurality oftools and corresponding plurality of split holders; and fastening theplurality of tools and corresponding plurality of split holders at thepolishing height.
 13. The method of claim 11, wherein loading themulti-port polishing fixture assembly with the plurality of toolssecured within a corresponding plurality of split holders comprisesfastening the plurality of split holders to a perimeter surface of afixture base with a plurality of kinematic clamps.
 14. A pick and placebond head comprising: an elongate body; a pedestal at a distal end ofthe elongate body; and a plurality of mesa structures extending from thepedestal, each mesa structure including a distal bond surface includingone or more vacuum holes.
 15. The pick and place bond head of claim 14,wherein the one or more vacuum holes extend through an axial length ofthe elongate body.
 16. The pick and place bond head of claim 14, whereinthe one or more vacuum holes is a plurality of vacuum holes fluidlyconnected to a shared vacuum channel in the pick and place bond head.17. The pick and place bond head of claim 14, wherein the distal bondsurface is characterized by an average surface roughness (Ra) of 50nm-0.5 μm.
 18. The pick and place bond head of claim 14, wherein thedistal bond surface is characterized by a flatness of less than 300 nm.19. The pick and place bond head of claim 14, wherein a total surfacearea including each distal bond surface of the pick and place bond headis characterized by a flatness of less than 300 nm.
 20. The pick andplace bond head of claim 14, wherein the distal bond surface has amaximum lateral dimension of less than 500 μm.
 21. The pick and placebond head of claim 20, wherein each vacuum hole has a maximum width ofless than 75 μm.